IRF7325

MOSFET 2P-CH 12V 7.8A 8-SOIC

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SeekIC No. : 003430066 Detail

IRF7325: MOSFET 2P-CH 12V 7.8A 8-SOIC

floor Price/Ceiling Price

Part Number:
IRF7325
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Quick Details

Series: HEXFET® Manufacturer: International Rectifier
FET Type: 2 P-Channel (Dual) FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 12V Current - Continuous Drain (Id) @ 25° C: 7.8A
Gate-Source Cutoff Voltage : - 4.5 V Rds On (Max) @ Id, Vgs: 24 mOhm @ 7.8A, 4.5V
Vgs(th) (Max) @ Id: 900mV @ 250µA Gate Charge (Qg) @ Vgs: 33nC @ 4.5V
Input Capacitance (Ciss) @ Vds: 2020pF @ 10V Power - Max: 2W
Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO    

Description

FET Feature: Logic Level Gate
Mounting Type: Surface Mount
FET Type: 2 P-Channel (Dual)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Drain to Source Voltage (Vdss): 12V
Power - Max: 2W
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Series: HEXFET®
Manufacturer: International Rectifier
Current - Continuous Drain (Id) @ 25° C: 7.8A
Packaging: Tube
Rds On (Max) @ Id, Vgs: 24 mOhm @ 7.8A, 4.5V
Gate Charge (Qg) @ Vgs: 33nC @ 4.5V
Input Capacitance (Ciss) @ Vds: 2020pF @ 10V


Features:

* Trench Technology
*Ultra Low On-Resistance
*Dual P-Channel MOSFET
*Low Profile (<1.8mm)
*Available in Tape & Reel





Pinout

  Connection Diagram




Specifications

Parameter Max. Units
VDS Drain- Source Voltage -12 V
ID @ TA = 25 Continuous Drain Current, VGS @ -4.5V -7.8 A
ID @ TA = 70 Continuous Drain Current, VGS @ -4.5V -6.2
IDM Pulsed Drain Current  -39
PD @TA = 25 Power Dissipation 2.0 W
PD @TA = 70 Power Dissipation 1.3
Linear Derating Factor 16 W/
VGS Gate-to-Source Voltage ± 8.0 V
TJ, TSTG Junction and Storage Temperature Range -55 to + 150





Description

New P-Channel HEXFET® power MOSFETs IRF7325 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SO-8 IRF7325 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infrared, or wave soldering techniques.






Parameters:

Technical/Catalog InformationIRF7325
VendorInternational Rectifier
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET Polarity2 P-Channel (Dual)
Drain to Source Voltage (Vdss)12V
Current - Continuous Drain (Id) @ 25° C7.8A
Rds On (Max) @ Id, Vgs24 mOhm @ 7.8A, 4.5V
Input Capacitance (Ciss) @ Vds 2020pF @ 10V
Power - Max2W
PackagingTube
Gate Charge (Qg) @ Vgs33nC @ 4.5V
Package / Case8-SOIC (3.9mm Width)
FET FeatureLogic Level Gate
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names IRF7325
IRF7325



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