MOSFET 2P-CH 20V 9A 8-SOIC
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Series: | HEXFET® | Manufacturer: | International Rectifier |
FET Type: | 2 P-Channel (Dual) | FET Feature: | Logic Level Gate |
Drain to Source Voltage (Vdss): | 20V | Gate-Source Cutoff Voltage : | - 4.5 V |
Current - Continuous Drain (Id) @ 25° C: | 9A | Rds On (Max) @ Id, Vgs: | 18 mOhm @ 9A, 4.5V |
Vgs(th) (Max) @ Id: | 1V @ 250µA | Gate Charge (Qg) @ Vgs: | 63nC @ 5V |
Input Capacitance (Ciss) @ Vds: | 2940pF @ 15V | Power - Max: | 2W |
Mounting Type: | Surface Mount | Package / Case: | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package: | 8-SO |
Parameter |
Max. |
Units | |
VDS |
Drain- Source Voltage |
-20 |
V |
ID @ TA = 25°C |
Continuous Drain Current, VGS @ -4.5V |
-9.0 |
A |
ID @ TA= 70°C |
Continuous Drain Current, VGS @ -4.5V |
-7.1 | |
IDM |
Pulsed Drain Current |
-71 | |
PD @TA = 25°C |
Maximum Power Dissipationƒ |
2.0 |
W |
PD @TA = 70°C |
Maximum Power Dissipationƒ |
1.3 |
W |
Linear Derating Factor |
16 |
mW/°C | |
VGSM |
Gate-to-Source Voltage |
± 12 |
V |
TJ, TSTG |
Junction and Storage Temperature Range |
-55 to + 150 |
°C |
New trench HEXFET® Power MOSFETs IRF7324 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.This benefit, combined with the ruggedized device design that HEXFET power MOSFETs are well known for,provides the designer with an extremely efficient and reliable device IRF7324 for use in battery and load management applications.