Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 6.6 A ID @ TA = 100°C Continuous Drain Current, VGS @ -10V 5.3 A IDM Pulsed Drain Current 26 A PD @TA = 25°CTA = 70°C Maximum Power Dissipation 2.52.0 W Linear Derating Fac...
IRF7311: Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 6.6 A ID @ TA = 100°C Continuous Drain Current, VGS @ -10V 5.3 A IDM Pulsed Drain Cur...
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Parameter | Max. | Units | |
ID @ TA = 25°C | Continuous Drain Current, VGS @ -10V | 6.6 | A |
ID @ TA = 100°C | Continuous Drain Current, VGS @ -10V | 5.3 | A |
IDM | Pulsed Drain Current | 26 | A |
PD @TA = 25°C TA = 70°C |
Maximum Power Dissipation | 2.5 2.0 |
W |
Linear Derating Factor | 1.3 | mW/°C | |
VDS | 20 | 20 | V |
VGS | Gate-to-Source Voltage | ± 12 | V |
EAS | Single Pulse Avalanche Energy | 100 | mJ |
IAR | Avalanche Current | 4.1 |
A |
EAR | Repetitive Avalanche Energy | 0.20 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 5.0 | |
TJ , TSTG | Junction and Storage Temperature Range | -55 to + 175 | °C |
Fifth Generation HEXFETs IRF7311 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SO-8 IRF7311 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.