IRF7311

Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 6.6 A ID @ TA = 100°C Continuous Drain Current, VGS @ -10V 5.3 A IDM Pulsed Drain Current 26 A PD @TA = 25°CTA = 70°C Maximum Power Dissipation 2.52.0 W Linear Derating Fac...

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SeekIC No. : 004376716 Detail

IRF7311: Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 6.6 A ID @ TA = 100°C Continuous Drain Current, VGS @ -10V 5.3 A IDM Pulsed Drain Cur...

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Part Number:
IRF7311
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/29

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Product Details

Description



Specifications

Parameter Max. Units
ID @ TA = 25°C Continuous Drain Current, VGS @ -10V 6.6 A
ID @ TA = 100°C Continuous Drain Current, VGS @ -10V 5.3 A
IDM Pulsed Drain Current 26 A
PD @TA = 25°C
TA = 70°C
Maximum Power Dissipation 2.5
2.0
W
Linear Derating Factor 1.3 mW/°C
VDS 20 20 V
VGS Gate-to-Source Voltage ± 12 V
EAS Single Pulse Avalanche Energy 100 mJ
IAR Avalanche Current 4.1
A
EAR Repetitive Avalanche Energy 0.20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0
TJ , TSTG Junction and Storage Temperature Range -55 to + 175 °C





Description

Fifth Generation HEXFETs IRF7311 from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SO-8 IRF7311 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.






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