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IRF7307

Specifications Parameter N-Channel Max.P-Channel Units ID @ TA = 25°C 10 Sec. Pulse Drain Current, VGS @ 4.5V 5.7 -4.7 A ID @ TA = 25°C Continuous Drain Current, VGS @ 4.5V 5.2 -4.3 A ID @ TA = 70°C Continuous Drain Current, VGS @ 4.5V 4.1 -3.4 A IDM Pulsed Drain...

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SeekIC No. : 004376708 Detail

IRF7307: Specifications Parameter N-Channel Max.P-Channel Units ID @ TA = 25°C 10 Sec. Pulse Drain Current, VGS @ 4.5V 5.7 -4.7 A ID @ TA = 25°C Continuous Drain Current, VGS @ 4.5V 5.2...

IRF7307 Data Sheet

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Part Number:
IRF7307
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Specifications

Parameter N-Channel Max.P-Channel Units
ID @ TA = 25°C 10 Sec. Pulse Drain Current, VGS @ 4.5V 5.7 -4.7 A
ID @ TA = 25°C Continuous Drain Current, VGS @ 4.5V 5.2 -4.3 A
ID @ TA = 70°C Continuous Drain Current, VGS @ 4.5V 4.1 -3.4 A
IDM Pulsed Drain Current 21 -17 A
PD @TA = 25°C Maximum Power Dissipation 2.0 W
Linear Derating Factor 0.016 mW/°C
VGS Gate-to-Source Voltage ± 12 V
dv/dt Peak Diode Recovery dv/dt 5.0 -5.0
TJ , TSTG Junction and Storage Temperature Range -55 to + 175 °C





Description

Fifth Generation HEXFETs IRF7307 from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.

The SO-8 IRF7307 has been modified through a customized leadframe for enhanced thermal characteristics and\ multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.






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