Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Mounting Type: Surface Mount
Drain to Source Voltage (Vdss): 20V
FET Type: MOSFET P-Channel, Metal Oxide
FET Feature: Standard
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power - Max: 2.5W
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Series: HEXFET®
Current - Continuous Drain (Id) @ 25° C: 5.3A
Gate Charge (Qg) @ Vgs: 25nC @ 10V
Packaging: Tube
Supplier Device Package: 8-SO
Manufacturer: International Rectifier
Input Capacitance (Ciss) @ Vds: 860pF @ 10V
Rds On (Max) @ Id, Vgs: 60 mOhm @ 5.3A, 10V
Features: * Adavanced Process Technology
* Ultra Low On-Resistance
* P-Channel MOSFET
* Surface Mount
* Available in Tape & Reel
* Dynamic dv/dt Rating
* Fast SwitchingPinout
Specifications
|
Parameter |
Max. |
Units |
| ID @ TC = 25 |
Continuous Drain Current, VGS @ 10V |
-5.3 |
A |
| ID @ TC = 70 |
Continuous Drain Current, VGS @ 10V |
-4.2 |
| IDM |
Pulsed Drain Current |
-21 |
| PD @TC = 25 |
Power Dissipation |
2.5 |
W |
|
Linear Derating Factor |
0.020 |
mW/ |
| VGS |
Gate-to-Source Voltage |
± 12 |
V |
| dv/dt |
Peak Diode Recovery dv/dt |
-1.7 |
V/ns |
| TJ, TSTG |
Junction and Storage Temperature Range |
-55 to + 150 |
|
DescriptionFourth Generation HEXFETs IRF7204 from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
The SO-8 IRF7204 has been modified through a customized leadframe for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
IRF7204 Data Sheet
