MOSFET N-CH 50V 3A 8-SOIC
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Parameter | Max. | Units | |
ID @ TC = 25 | Continuous Drain Current, VGS @ 4.5V | 3.0 | A |
ID @ TC = 70 | Continuous Drain Current, VGS @ 4.5V | 2.3 | |
IDM | Pulsed Drain Current | 10 | |
PD @TC = 25 | Power Dissipation | 2.0 | W |
Linear Derating Factor | 0.016 | mW/ | |
VGS | Gate-to-Source Voltage | ± 20 | V |
dv/dt | Peak Diode Recovery dv/dt | 4.5 | V/ns |
TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 |
Fourth Generation HEXFETs of the IRF7103 from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
The IRF7103 has been modified through a customized leadframe for enhanced thermal characteristics and dual-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
Technical/Catalog Information | IRF7103 |
Vendor | International Rectifier |
Category | Discrete Semiconductor Products |
Mounting Type | Surface Mount |
FET Polarity | 2 N-Channel (Dual) |
Drain to Source Voltage (Vdss) | 50V |
Current - Continuous Drain (Id) @ 25° C | 3A |
Rds On (Max) @ Id, Vgs | 130 mOhm @ 3A, 10V |
Input Capacitance (Ciss) @ Vds | 290pF @ 25V |
Power - Max | 2W |
Packaging | Tube |
Gate Charge (Qg) @ Vgs | 30nC @ 10V |
Package / Case | 8-SOIC (3.9mm Width) |
FET Feature | Standard |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | IRF7103 IRF7103 |