Features: · Ultra Low On-Resistance· P-Channel MOSFET· Surface Mount· Available in Tape & Reel· Low Gate ChargePinoutSpecifications Parameter Max. Units VDS Drain-Source Voltage -40 V ID @ TA = 25 Continuous Drain Current, VGS @ -10V -3.4 A ID @ TA = 70 Con...
IRF5803: Features: · Ultra Low On-Resistance· P-Channel MOSFET· Surface Mount· Available in Tape & Reel· Low Gate ChargePinoutSpecifications Parameter Max. Units VDS Drain-Source Voltage...
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Parameter |
Max. |
Units | |
VDS | Drain-Source Voltage |
-40 |
V |
ID @ TA = 25 | Continuous Drain Current, VGS @ -10V |
-3.4 |
A |
ID @ TA = 70 | Continuous Drain Current, VGS @ -10V |
-2.7 | |
IDM | Pulsed Drain Current |
-27 | |
PD @TA = 25 | Power Dissipation |
2.0 |
W
|
PD @TA = 70 | Power Dissipation |
1.3 | |
Linear Derating Factor |
16 |
W/ | |
VGS | Gate-to-Source Voltage |
± 20 |
V |
TJ,TSTG | Junction and Storage Temperature Range |
-55 to + 150 |
These P-channel HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit of IRF5803 provides the designer with an extremely efficient device for use in battery and load management applications.
The TSOP-6 package with its customized leadframe produces a HEXFET® power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package of IRF5803 is ideal for applications where printed circuit board space is at a premium. IRF5803's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.