Features: Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in Tape & Reel Low Gate ChargeLead-FreePinoutSpecifications Parameter Max. Units VDS Drain- Source Voltage -30 V ID @ TA = 25 Continuous Drain Current, VGS @ -4.5V -4.0 A ID @ TA= 70...
IRF5800PbF: Features: Ultra Low On-Resistance P-Channel MOSFET Surface Mount Available in Tape & Reel Low Gate ChargeLead-FreePinoutSpecifications Parameter Max. Units VDS Drain- Source Vo...
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Parameter |
Max. |
Units | |
VDS | Drain- Source Voltage |
-30 |
V |
ID @ TA = 25 | Continuous Drain Current, VGS @ -4.5V |
-4.0 |
A |
ID @ TA= 70 | Continuous Drain Current, VGS @ -4.5V |
-3.2 | |
IDM | Pulsed Drain Current |
-32 | |
PD @TA = 25 | Power Dissipation |
2.0 |
W |
PD @TA = 70 | Power Dissipation |
1.3 | |
Linear Derating Factor |
0.016 |
W/ | |
EAS | Single Pulse Avalanche Energy |
20.6 |
mJ |
VGS | Gate-to-Source Voltage |
± 20 |
V |
TJ, TSTG | Junction and Storage Temperature Range |
-55 to + 150 |
These P-channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit of IRF5800PbF provides the designer with an extremely efficient device for use in battery and load management applications.
The TSOP-6 package with its customized leadframe produces a HEXFET power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package of IRF5800PbF is ideal for applications where printed circuit board space is at a premium. IRF5800PbF's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.