MOSFET N-CH 100V 17A TO-262
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Series: | HEXFET® | Manufacturer: | International Rectifier | ||
FET Type: | MOSFET N-Channel, Metal Oxide | Transistor Type: | - | ||
Gain : | 19.5 dB | Current - Collector (Ic) (Max): | - | ||
FET Feature: | Logic Level Gate | Drain to Source Voltage (Vdss): | 100V | ||
Voltage - Collector Emitter Breakdown (Max): | - | Current - Continuous Drain (Id) @ 25° C: | 17A | ||
Vce Saturation (Max) @ Ib, Ic: | - | Current - Collector Cutoff (Max): | - | ||
Rds On (Max) @ Id, Vgs: | 90 mOhm @ 9A, 10V | DC Current Gain (hFE) (Min) @ Ic, Vce: | - | ||
Vgs(th) (Max) @ Id: | 4V @ 250µA | Gate Charge (Qg) @ Vgs: | 37nC @ 10V | ||
Frequency - Transition: | - | Input Capacitance (Ciss) @ Vds: | 920pF @ 25V | ||
Power - Max: | 3.8W | Mounting Type: | Through Hole | ||
Package / Case: | TO-262-3 Long Leads, I²Pak, TO-262AA | Supplier Device Package: | TO-262 |
Parameter | Max. | Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 17 | A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 12 | A |
IDM | Pulsed Drain Current | 60 | A |
PD @TA = 25°C | Power Dissipation | 3.8 | w |
PD @TC = 25°C | Power Dissipation | 70 | W |
Linear Derating Factor | 0.47 | mW/°C | |
VGS | Gate-to-Source Voltage | ± 20 | V |
IAR | Avalanche Current | 9.0 | A |
EAR | Repetitive Avalanche Energy | 7.0 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 7.4 | V/ns |
TJ , TSTG | Junction and Storage Temperature Range | -55 to +175 | °C |
Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) | °C |
Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit of IRF530NL, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. IRF530NL provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of IRF530NL low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRF530NL) is available for low-profile applications.