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IRF5305S/L

Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @- 10V -31 A ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -22 IDM Pulsed Drain Current -110 PD @TA = 25°C Power Dissipation 3.8 W PD @TC = 25°C Power Dissi...

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IRF5305S/L: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @- 10V -31 A ID @ TC = 100°C Continuous Drain Current, VGS @ -10V -22 IDM Pulsed ...

IRF5305S/L Data Sheet

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Part Number:
IRF5305S/L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Specifications

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @- 10V
-31
A
ID @ TC = 100°C Continuous Drain Current, VGS @ -10V
-22
IDM Pulsed Drain Current
-110
PD @TA = 25°C Power Dissipation
3.8
W
PD @TC = 25°C Power Dissipation
110
W
  Linear Derating Factor
0.71
W/°C
VGS Gate-to-Source Voltage
± 20
V
EAS Single Pulse Avalanche Energy
280
mJ
IAR Avalanche Current
-16
A
EAR Repetitive Avalanche Energy
11
mJ
dv/dt Peak Diode Recovery dv/dt
-5.8
V/ns

TJ
TSTG

 Operating Junction and
Storage Temperature Range
-55 to + 175
°C
  Soldering Temperature, for 10 seconds
300 (1.6mm from case )



Description

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit of IRF5305S/L, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. IRF5305S/L provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of IRF5305S/L low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF5305L) is available for lowprofile applications.




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