Features: `4.0A and 5.0A, 150V and 200V`rDS(ON)= 0.8 and 1.2`SOA is Power Dissipation Limited`Nanosecond Switching Speeds`Linear Transfer Characteristics`High Input Impedance`Majority Carrier Device`Related Literature-TB334 Guidelines for Soldering Surface Moun Components to PC Boards Specificatio...
IRF223: Features: `4.0A and 5.0A, 150V and 200V`rDS(ON)= 0.8 and 1.2`SOA is Power Dissipation Limited`Nanosecond Switching Speeds`Linear Transfer Characteristics`High Input Impedance`Majority Carrier Device...
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IRF220 | IRF221 | IRF222 | IRF223 | UNITS | ||
Drain to Source Voltage (Note 1) | VDS | 200 | 150 | 200 | 150 | V |
Drain to Gate Voltage (RGS = 20k)(Note 1) |
VDGR | 200 | 150 | 200 | 150 | V |
Continuous Drain Current | ID | 5.0 | 5.0 | 4.0 | 4.0 | A |
TC = 100 |
ID | 3.0 | 3.0 | 2.5 | 2.5 | A |
Pulsed Drain Current (Note 3) | IDM | 20 | 20 | 16 | 16 | A |
Gate to Source Voltage. | VGS | ±20 | ±20 | ±20 | ±20 | V |
Maximum Power Dissipation | PD | 40 | 40 | 40 | 40 | W |
Linear Derating Factor | 0.32 |
0.32 |
0.32 | 0.32 | W/ | |
Single Pulse Avalanche Energy Rating (Note 4) | EAS | 85 | 85 | 85 | 85 | mJ |
Operating and Storage Temperature | TJ , TSTG | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | |
Maximum Temperature for Soldering | ||||||
Leads at 0.063in (1.6mm) from case for 10s | TL | 300 | 300 | 300 | 300 | |
Package Body for 10s, see TB334 | Tpkg | 260 | 260 | 260 | 260 |
These are N-Channel enhancement mode silicon gate power ?eld effect transistors. They are advanced power MOSFETs designed, tested, and guaranteed to withstand a specied level of energy in the breakdown avalanche mode of operation. All of these power MOSFETs of the IRF223 are designed for applications such as switching regulators, switching conver- tors, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
Formerly developmental type IRF223.