Features: · Output Power MOSFETs in half-bridge configuration· High side gate drive designed for bootstrap operation· Bootstrap diode integrated into package (HD type)· Accurate timing control for both Power MOSFETs Matched delay to get 50% duty cycle Matched deadtime of 1.2us· Internal oscillato...
IR51H320: Features: · Output Power MOSFETs in half-bridge configuration· High side gate drive designed for bootstrap operation· Bootstrap diode integrated into package (HD type)· Accurate timing control for b...
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Symbol | Definition | Minimum | Maximum | Units | |
VIN | High voltage supply | -224 | - 0.3 | 250 | V |
-320 | - 0.3 | 400 | |||
-420 | - 0.3 | 500 | |||
VB | High side floating supply | Vo - 0.3 | Vo +2.5 | ||
VO | Half-bridge output | -0.3 | VIN + 0.3 | ||
VRT | RT voltage | -0.3 | Vcc + 0.3 | ||
VCT | CT voltage | -0.3 | Vcc + 0.3 | ||
Icc | Supply current (note 1) | - | 25 | mA | |
IRT | RT output current | - 5 | 5 | ||
dV/dt | Peak diode recovery | - | 3.5 | V/ns | |
PD | Package power dissipation @ TA +25°C | - | 2.00 | W | |
RthJA | Thermal resistance, junction to ambient | - | 60 | /W | |
TJ | Junction temperature | -55 | 150 | ||
TS |
Storage temperature | -55 | 150 | ||
TL | Lead temperature (soldering, 10 seconds) | - | 300 |
The IR51H320 are complete high voltage, high speed, selfoscillating half-bridge circuits. Proprietary HVIC and latch immune CMOS technologies, along with the HEXFET® power MOSFET technology, enable ruggedized single package construction. The front-end features a programmable oscillator which functions similar to the CMOS 555 timer. The supply to the control circuit has a zener clamp to simplify offline operation. The output features two HEXFETs in a half-bridge configuration with an internally set deadtime designed for minimum cross-conduction in the half-bridge. Propagation delays of the IR51H320 for the high and low side power MOSFETs are matched to simplify use in 50% duty cycle applications. The device can operate up to 500 volts.