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IR140CSP

Features: ·Ultra Low VF per Footprint Area·Low Thermal Resistance·One-fifth Footprint of SMA·Super Low Profile (<.8mm)·Available Tested on Tape & ReelSpecifications Parameters Value Units Conditions IF(AV) Max. Average Forward Current 1.0 A 50% duty cycle @ TPCB = 112 , rectan...

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SeekIC No. : 004376018 Detail

IR140CSP: Features: ·Ultra Low VF per Footprint Area·Low Thermal Resistance·One-fifth Footprint of SMA·Super Low Profile (<.8mm)·Available Tested on Tape & ReelSpecifications Parameters Value Un...

IR140CSP Data Sheet

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Part Number:
IR140CSP
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·Ultra Low VF per Footprint Area
·Low Thermal Resistance
·One-fifth Footprint of SMA
·Super Low Profile (<.8mm)
·Available Tested on Tape & Reel


Specifications

Parameters Value Units Conditions
IF(AV) Max. Average Forward Current 1.0 A 50% duty cycle @ TPCB = 112 , rectangular wave form
IFSM Max. Peak One Cycle Non-Repetitive
Surge Current @ 25		 250 A 5µs Sine or 3µs Rect. pulse Following any rated
load condition and
with rated VRRM applied
21 10ms Sine or 6ms Rect. pulse
EAS Non- Repetitive Avalanche Energy 10 mJ TJ = 25 , IAS = 2.0A, L = 5.0mH
IAR Repetitive Avalanche Current 2.0 A Current decaying linearly to zero in 1 µsec
Frequency limited by TJ max. Va = 1.5 x Vr typical



Description

True chip-scale packaging of the IR140CSP is available from International Rectifier. The IR140CPS surface-mount Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards. Typical applications are in disk drives, switching power supplies, converters, free-wheeling diodes, battery charging, and reverse battery protection.

·Small foot print, surface mountable
·Low forward voltage drop
·High frequency operation
·Guard ring for enhanced ruggedness and long term reliability

The FlipkyTM package of the IR140CSP, is one-fifth the footprint of a comparable SMA package and has a profile of less then .8mm. Combined with the low thermal resistance of the die level device, this makes the FlipkyTM the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.




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