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IR130CSP

Features: ·Ultra Low VF per Footprint Area·Low Thermal Resistance·One-fifth Footprint of SMA·Super Low Profile (<.8mm)·Available Tested on Tape & ReelSpecifications Parameters Values Units Conditions IF(AV) Max. Average Forward (Per Leg) Current (Per Device) 1 ...

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SeekIC No. : 004376014 Detail

IR130CSP: Features: ·Ultra Low VF per Footprint Area·Low Thermal Resistance·One-fifth Footprint of SMA·Super Low Profile (<.8mm)·Available Tested on Tape & ReelSpecifications Parameters Va...

IR130CSP Data Sheet

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Part Number:
IR130CSP
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

·Ultra Low VF per Footprint Area
·Low Thermal Resistance
·One-fifth Footprint of SMA
·Super Low Profile (<.8mm)
·Available Tested on Tape & Reel


Specifications

Parameters
Values
Units
Conditions
IF(AV)
 Max. Average Forward (Per Leg)
Current (Per Device)
1
A
 50% duty cycle @ TC = 113 , rectangular wave form
IFSM
 Max.Peak One Cycle Non -Repetitive
Surge Current (Per Leg)
220
21
A
 5s Sine or 3s Rect. pulse Following any rated load
condition and with rated
VRRM applied
10ms Sine or 6ms Rect. pulse
EAS
Non -Repetitive Avalanche Energy
(Per Leg)
10
mJ
 TJ = 25 IAS = 3Amps, L = 4.40mH
IAR
 Repetitive Avalanche Current Current
(Per Leg)
2
A
 decaying linearty to zero in 1 sec
Frequency limited by TJ max. VA = 1.5 x VR typical



Description

True chip-scale packaging of the IR130CSP is available from International Rectifier. The IR130CPS surface-mount Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards.Typical applications are in disk drives, switching power supplies, converters, free-wheeling diodes, battery charging, and reverse battery protection.

·Small foot print, surface mountable
·Low forward voltage drop
·High frequency operation
·Guard ring for enhanced ruggedness and long term reliability

The FlipkyTM package of the IR130CSP, is one-fifth the footprint of a comparable SMA package and has a profile of less then.8mm. Combined with the low thermal resistance of the die level device, this makes the FlipkyTM the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.




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