Features: • Output Power IGBT's in half-bridge configuration• 575V rated breakdown voltage• High side gate drive designed for bootstrap operation• Matched propagation delay for both channels• Independent high and low side output channels (IR062HD4C10U-P2) or cross-con...
IR062HD4C10U-P2: Features: • Output Power IGBT's in half-bridge configuration• 575V rated breakdown voltage• High side gate drive designed for bootstrap operation• Matched propagation delay f...
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Features: Junction Size: Square 60 x 60 milsWafer Size: 4 VRRM Class: 600 V Passivation Process: ...
Features: Junction Size: Square 60 x 60 milsWafer Size: 4 VRRM Class: 1200 VPassivation Process: G...
Symbol | Definition | Min. | Max. | Units |
VIN | High voltage supply | - 0.3 | 575 | V |
VB | High side floating supply absolute voltage | VO -0.3 | VO+ 25 | |
VO | Half-bridge output voltage | - 0.3 | VIN+ 0.3 | |
VIH/VIL | Logic input voltage (HIN & LIN) | - 0.3 | Vcc + 0.3 | |
VCC | Low side and logic fixed supply voltage | - 0.3 | 25 | |
dV/dt | Peak diode recovery dv/dt | - | 3.50 | V/ns |
PD | Package power dissipation @ TA +25 | - | 3.00 | W |
RthJA | Thermal resistance, junction to ambient | - | 50 | /W |
RthJc | Thermal resistance, junction to case (metal) | - | 20 | |
TJ | Junction temperature | -55 | 150 | |
TS | Storage temperature | -55 | 150 | |
TL | Lead temperature (soldering, 10 seconds) | - | 300 |
The IR062HD4C10U-P2 / IR082HD4C10U-P2 are high voltage, high speed half bridges. Proprietary HVIC and latch immune CMOS technologies, along with the power IGBT technology, enable ruggedized single package construction. The logic inputs are compatible with standard CMOS or LSTTL outputs, down to 3.3V logic. The frontend features an independent high and low side driver in phase with the logic compatible input signals. The output of the IR062HD4C10U-P2 features two IGBT's in a halfbridge configuration. Propagation delays for the high and low side power IGBT's are matched to simplify use. The device can operate up to 575 volts.