Features: • N-channel, normal level• Excellent gate charge x RDS(on) product (FOM)• Very low on-resistance RDS(on)• 175 °C operating temperature• Pb-free lead plating; RoHS compliant• Qualified according to JEDEC1) for target application• Ideal for high-fr...
IPB06CN10NG: Features: • N-channel, normal level• Excellent gate charge x RDS(on) product (FOM)• Very low on-resistance RDS(on)• 175 °C operating temperature• Pb-free lead plating; ...
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Parameter | Symbol | Conditions | Value | Unit |
Continuous drain current | I D | T C=25 2) | 100 | A |
T C=100 | 88 | |||
Pulsed drain current3) | I D,pulse | T C=25 3) | 400 | |
Avalanche energy, single pulse | E AS | I D=100 A, R GS=25 | 480 | mJ |
Reverse diode dv /dt | dv /dt | I D=100 A, V DS=80 V, di /dt =100 A/s, T j,max=175 |
6 | kV/s |
Gate source voltage4) | V GS | ±20 | V | |
Power dissipation | P tot | T C=25 | 214 | W |
Operating and storage temperature | T j, T stg | -55 ... 175 | ||
IEC climatic category; DIN IEC 68-1 | 55/175/56 |
1)J-STD20 and JESD22
5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air.
4) Tjmax=150 °C and duty cycle D=0.01 for Vgs<-5V
2) Current is limited by bondwire; with an RthJC=0.7 K/W the chip is able to carry 124 A.
3) See figure 3