ILC-3SH-2.0G

The Multi-Mix PICO™ ILC-SH ILC-3SH-2.0G series provides a power divider and combiner function with low insertion loss, high isolation, and high power handling in a small outline. The ILC ILC-3SH-2.0G series are composed of serial connected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do not.

Accurate phase and amplitude balance make them ideal for applications involving power amplifiers, signal distribution and processing. ILC-SH ILC-3SH-2.0G in-line multicouplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques. The ILC-SH ILC-3SH-2.0G series is an easy to install SMD designed specifically for the full spectrum of wireless applications.

The high stability ceramic filled PTFE ILC-3SH-2.0G dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.