ILC-3F-2.0G

The Multi-Mix® ILC-F series provides a power divider and combiner function with low insertion loss, high isolation, and high power handling in a small outline. The ILC series are composed of serial connected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do not.

Accurate phase and amplitude balance make them ideal for applications involving power amplifiers,signal distribution and processing.

ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding proc
ess yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.

The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.
Additional benefits include:
• Cost effective for commercial wireless applications
• Operating temperature range 55°C to +85°C.
• Can be integrated with other Multi-Mix® components in a multi-function module

The Multi-Mix® ILC-F series provides a power divider and combiner function with low insertion loss, high isolation, and high power handling in a small outline. The ILC ILC-3F-2.0G series are composed of serial connected multi-couplers with each coupler having a different nominal coupling value. Equal split loss of ILC-3F-2.0G is maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do not.

Accurate phase and amplitude balance make ILC-3F-2.0G ideal for applications involving power amplifiers, signal distribution and processing.

ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process of ILC-3F-2.0G yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.

The ILC-F ILC-3F-2.0G series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.
Additional benefits include:
• Cost effective for commercial wireless applications
• Operating temperature range 55°C to +85°C.
• Can be integrated with other Multi-Mix® components in a multi-function module