IL208

Features: · Standard SOIC-8 Footprint with 0.05 Lead Spacing· Specified min. and max. CTR at 10mA IF , 5V VCEIL205 , 40 - 80%IL206 , 63 - 125%IL207 , 100 - 200%IL208 , 160 - 320%·Specified minimum CTR at 10mA IF , 5V VCEIL211 , 20%IL212 , 50%IL213 , 100%·Specified minimum CTR at 1mA IF , 5V VCEIL...

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IL208 Picture
SeekIC No. : 004373918 Detail

IL208: Features: · Standard SOIC-8 Footprint with 0.05 Lead Spacing· Specified min. and max. CTR at 10mA IF , 5V VCEIL205 , 40 - 80%IL206 , 63 - 125%IL207 , 100 - 200%IL208 , 160 - 320%·Specified minimum ...

floor Price/Ceiling Price

Part Number:
IL208
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/29

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Product Details

Description



Features:

· Standard SOIC-8 Footprint with 0.05" Lead Spacing
· Specified min. and max. CTR at 10mA IF , 5V VCE
IL205 , 40 - 80%
IL206 , 63 - 125%
IL207 , 100 - 200%
IL208 , 160 - 320%
·Specified minimum CTR at 10mA IF , 5V VCE
IL211 , 20%
IL212 , 50%
IL213 , 100%
·Specified minimum CTR at 1mA IF , 5V VCE
IL215 , 20%
IL216 , 50%
IL217 , 100%
· Isolation Voltage , 2500 VRMS
· High BVCEO (70V min)
· All electrical parameters 100% tested
· Available in Tape and Reel - add suffix " T& R "
· Custom Electrical Selections available



Application

· Computer Terminals
· Industrial Systems Controllers
· Hybrid substrates that require high density mounting
·Signal Transmission between systems of different potentials and impedances




Specifications

Storage Temperature ...................-550C to +1250C
Operating Temperature................ -550C to +1000C
Lead Soldering Temperature......................... 2600C
(single wave for 10 secs)
Input to Output Isolation Voltage ............2500VRMS



Description

This series of optically coupled isolators of the IL208 consist of a Gallium Arsenide infrared emitting diode and NPN silicon photo transistor mounted in a standard 8 pin SOIC package,which makes them ideally suited for high density applications with limited space.




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