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IDT74FCT163374

Features: 0.5 MICRON CMOS TechnologySK(o) (Output Skew) < 250ps Typical tESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)Packages include 25 mil pitch SSOP, 19.6 mil pitch TSSOP and 15.7 mil pitch TVSOPExtended commercial range of -40 to +85VCC = 3.3V...

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SeekIC No. : 004372925 Detail

IDT74FCT163374: Features: 0.5 MICRON CMOS TechnologySK(o) (Output Skew) < 250ps Typical tESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)Packages include 25 mil pitch ...

IDT74FCT163374 Data Sheet

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Part Number:
IDT74FCT163374
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

0.5 MICRON CMOS Technology
SK(o) (Output Skew) < 250ps Typical t
ESD > 2000V per MIL-STD-883, Method 3015;> 200V using machine model (C = 200pF, R = 0)
Packages include 25 mil pitch SSOP, 19.6 mil pitch TSSOP and 15.7 mil pitch TVSOP
Extended commercial range of -40 to +85
VCC = 3.3V ?0.3V, Normal Range or VCC = 2.7 to 3.6V, Extended Range
CMOS power levels (0.4W typ. static)
Rail-to-Rail output swing for increased noise margin
Low Ground Bounce (0.3V typ.)
Inputs (except I/O) can be driven by 3.3V or 5V components


Pinout

Connection Diagram


Specifications

Connection Diagram


Description

      The IDT74FCT163374 16-bit edge-triggered D-type registers are built using advanced dual metal CMOS technology.These high-speed, low-power registers are ideal for use as buffer registers for data synchronization and storage.  The Output Enable (xOE) and clock (xCLK) controls are organized to operate each device as two 8-bit registers or one 16-bit register with common clock.  Flow-through organization of signal pins facilitates ease of layout.   All inputs are designed with hysteresis for improved noise margin.

      The inputs of IDT74FCT163374 can be driven from either 3.3V or 5V devices.  This feature allows the use of these devices as translators in a mixed 3.3V/5V supply system.




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