IDT71V65903

Features: ·256K x 36, 512K x 18 memory configurations· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)· ZBTTM Feature - No dead cycles between write and read cycles· Internally synchronized output buffer enable eliminates the need to control OE· Single R/W (READ/WRIT...

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IDT71V65903 Picture
SeekIC No. : 004372340 Detail

IDT71V65903: Features: ·256K x 36, 512K x 18 memory configurations· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)· ZBTTM Feature - No dead cycles between write and read cycles· I...

floor Price/Ceiling Price

Part Number:
IDT71V65903
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/28

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Product Details

Description



Features:

·256K x 36, 512K x 18 memory configurations
· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)
· ZBTTM Feature - No dead cycles between write and read cycles
· Internally synchronized output buffer enable eliminates the need to control OE
· Single R/W (READ/WRITE) control pin
·4-word burst capability (Interleaved or linear)
· Individual byte write (BW1 - BW4) control (May tie active)
· Three chip enables for simple depth expansion
·3.3V power supply (±5%)
·3.3V (±5%) I/O Supply (VDDQ)
·Power down controlled by ZZ input
· Packaged in a JEDEC standard 100-pin plastic thin quad  flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA).



Pinout

  Connection Diagram




Specifications

Symbol
Rating
Commercial &
Industrial
Unit
VTERM(2)
Terminal Voltage with Respect to GND
-0.5 to +4.6
V
VTERM(3.6)
Terminal Voltage with Respect to GND
-0.5 to VDD
V
VTERM(4.6)
Terminal Voltage with Respect to GND
-0.5 to VDD +0.5
V
VTERM(5.6)
Terminal Voltage with Respect to GND
-0.5 to VDDQ +0.5
V
TA(7)
Commercial
0 to +70
oC
ndustrial
-40 to +85
oC
TBIAS
Temperature Under Bias
-55 to +125
oC
TSTG
Storage Temperature
-55 to +125
oC
PT
Power Dissipation
2.0
W
IOUT
DC Output Current
50
mA
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage
to the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
2. VDD terminals only.
3. VDDQ terminals only.
4. Input terminals only.
5. I/O terminals only.
6. This is a steady-state DC parameter that applies after the power supply has reached its nominal
operating value. Power sequencing is not necessary; however, the voltage on any input or I/O pin
cannot exceed VDDQ during power supply ramp up.
7. TA is the "instant on" case temperature.



Description

The IDT71V65903 are 3.3V high-speed 9,437,184-bit (9 Megabit) synchronous SRAMs organized as 256K x 36 / 512K x 18. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus they have been given the name ZBTTM, or Zero Bus Turnaround.

Address and control signals are applied to the SRAM during one clockcycle, and on the next clock cycle the associated data cycle occurs, be it read or write.

The IDT71V65903 contain address, data-in and control signal registers. The outputs are flow-through (no output data register). Output enable is the only asynchronous signal and can be used to disable the outputs at any given time.
 
A Clock Enable (CEN) pin allows operation of the IDT71V65903 tobesuspendedaslongasnecessary. Allsynchronousinputsareignoredwhen CEN is high and the internal device registers will hold their previous values.

There are three chip of the IDT71V65903 enable pins (CE1, CE2, CE2) that allow the user to deselect the device when desired. If any one of these three is not asserted when ADV/LD is low, no new memory operation can be initiated. However, any pending data transfers (reads or writes) will be completed. The data bus will tri-state one cycle after the chip is deselected or a write is initiated.

The IDT71V65903 have an on-chip burst counter. In the burst mode, the IDT71V65703/5903 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the LBO input pin. The LBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH).

The IDT71V65903 SRAMs utilize IDT's latest high-performance CMOS process and are packaged in a JEDEC Standard 14mm x 20mm 100- pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and a 165 fine pitch ball grid array (fBGA).




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