IDT71V3557SA

Features: · 128K x 36, 256K x 18 memory configurations· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)· ZBTTM Feature - No dead cycles between write and read cycles· Internally synchronized output buffer enable eliminates the need to control OE· Single R/W (READ/WRI...

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IDT71V3557SA Picture
SeekIC No. : 004372293 Detail

IDT71V3557SA: Features: · 128K x 36, 256K x 18 memory configurations· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)· ZBTTM Feature - No dead cycles between write and read cycles· ...

floor Price/Ceiling Price

Part Number:
IDT71V3557SA
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

· 128K x 36, 256K x 18 memory configurations
· Supports high performance system speed - 100 MHz (7.5 ns Clock-to-Data Access)
· ZBTTM Feature - No dead cycles between write and read cycles
· Internally synchronized output buffer enable eliminates the need to control OE· Single R/W (READ/WRITE) control pin
· 4-word burst capability (Interleaved or linear)
· Individual byte write (BW1 - BW4) control (May tie active)
· Three chip enables for simple depth expansion
· 3.3V power supply (±5%), 3.3V (±5%) I/O Supply (VDDQ)
· Optional Boundary Scan JTAG Interface (IEEE 1149.1 complaint)
· Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA)



Pinout

  Connection Diagram


Specifications

Symbol Rating

Commercial
& Industrial
Unit
VTERM(2) Terminal Voltage with Respect to GND
-0.5 to +4.6
V
VTERM(3,6) Terminal Voltage with Respect to GND
-0.5 to VDD
V
VTERM(4,6) Terminal Voltage with Respect to GND
-0.5 to VDD +0.5
V
VTERM(5,6) Terminal Voltage with Respect to GND
-0.5 to VDDQ +0.5
V
TA(7) Commercial Operating Temperature
-0 to +70
Industrial Operating Temperature
-40 to +85
TBIAS Temperature Under Bias
55 to +125
TSTG Storage Temperature
55 to +125
PT Power Dissipation
2.0
W
IOUT DC Output Current
50
mA

NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. VDD terminals only.
3. VDDQ terminals only.
4. Input terminals only.
5. I/O terminals only.
6. This is a steady-state DC parameter that applies after the power supply has reached its nominal operating value. Power sequencing is not necessary;however, the voltage on any input or I/O pin cannot exceed VDDQ during power
supply ramp up.
7. TA is the "instant on" case temperature.



Description

The IDT71V3557SA are 3.3V high-speed 4,718,592-bit (4.5 Megabit) synchronous SRAMs organized as 128K x 36/256K x 18. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus they have been given the name ZBTTM, or Zero Bus Turnaround.

Address and control signals are applied to the SRAM during one clock cycle, and on the next clock cycle the associated data cycle occurs, be it read or write.

The IDT71V3557SA contain address, data-in and control signal registers. The outputs are flow-through (no output data register). Output enable is the only asynchronous signal and can be used to disable the outputs at any given time.

A Clock Enable (CEN) pin allows operation of the IDT71V3557/59 to be suspended as long as necessary. All synchronous inputs are ignored when (CEN) is high and the internal device registers will hold their previous values.

There are three chip enable pins (CE1, CE2, CE2) of the IDT71V3557SA that allow the user to deselect the device when desired. If any one of these three is not asserted when ADV/LD is low, no new memory operation can be initiated. However, any pending data transfers (reads or writes) will be completed. The data bus will tri-state one cycle after chip is deselected or a write is initiated.

The IDT71V3557SA have an on-chip burst counter. In the burst mode, the IDT71V3557/59 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by theLBO input pin. TheLBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address (ADV/LD = LOW) or increment the internal burst counter (ADV/LD = HIGH).

The IDT71V3557SA SRAMs utilize IDT's latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and a 165 fine pitch ball grid array (fBGA).




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