Features: *128K x 36, 256K x 18 memory configurations*Supports high system speed: Commercial and Industrial:-150MHz 3.8ns clock access time-133MHz 4.2ns clock access time*LBOinput selects interleaved or linear burst mode*Self-timed write cycle with global write control (GW), byte write enable (BWE...
IDT71V2576SA: Features: *128K x 36, 256K x 18 memory configurations*Supports high system speed: Commercial and Industrial:-150MHz 3.8ns clock access time-133MHz 4.2ns clock access time*LBOinput selects interleave...
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Symbol |
Rating |
Value |
Unit |
VTERM(2) |
Terminal Voltage with |
-0.5 to +4.6 |
V |
VTERM(3,6) |
Terminal Voltage with |
0.5 to VDD |
V |
VTERM(4,6) |
Terminal Voltage with |
-0.5 to VDD+0.5 |
V |
VTERM(5,6) |
Terminal Voltage |
-0.5 to VDD+0.5 |
V |
TA(7) |
Commercial |
-0 to +70 |
oC |
Industrial |
-40 to +85 | ||
TBIAS |
Temperature Under Bias |
-55 to +125 |
oC |
TSTG |
Storage Temperature |
-55 to +125 |
oC |
PT |
Power Dissipation |
2.0 |
W |
IOUT |
DC Output Current |
50 |
mA |
The IDT71V2576SA are high-speed SRAMs organized as 128K x 36/256K x 18. The IDT71V2576SA SRAMs contain write, data, address and control registers. Internal logic allows the SRAM to generate a self- timed write based upon a decision which can be left until the end of the write cycle.
The burst mode feature offers the highest level of performance to the system designer, as the IDT71V2576/78 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will be pipelined for one cycle before it is available on the next rising clock edge. If burst mode operation is selected (ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin.
The IDT71V2576SA SRAMs utilize IDT's latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array (fBGA).