IC43R16160

Features: · High speed data transfer rates with system frequency up to 200 MHz· Data Mask for Write Control· Four Banks controlled by BA0 & BA1· ProgrammableCAS Latency: 2, 2.5, 3· Programmable Wrap Sequence: Sequential or Interleave· Programmable Burst Length: 2, 4, 8 for Sequential Type 2, 4...

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IC43R16160 Picture
SeekIC No. : 004370395 Detail

IC43R16160: Features: · High speed data transfer rates with system frequency up to 200 MHz· Data Mask for Write Control· Four Banks controlled by BA0 & BA1· ProgrammableCAS Latency: 2, 2.5, 3· Programmable ...

floor Price/Ceiling Price

Part Number:
IC43R16160
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/8

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Product Details

Description



Features:

· High speed data transfer rates with system frequency up to 200 MHz
· Data Mask for Write Control
· Four Banks controlled by BA0 & BA1
· Programmable CAS Latency: 2, 2.5, 3
· Programmable Wrap Sequence: Sequential or Interleave
· Programmable Burst Length:
    2, 4, 8 for Sequential Type
    2, 4, 8 for Interleave Type
· Automatic and Controlled Precharge Command
· Power Down Mode
· Auto Refresh and Self Refresh
· Refresh Interval: 8192 cycles/64 ms
· Available in 66-pin 400 mil TSOP
· SSTL-2 Compatible I/Os
· Double Data Rate (DDR)
· Bidirectional Data Strobe (DQS) for input and output data, active on both edges
· On-Chip DLL aligns DQ and DQs transitions with CK transitions
· Differential clock inputs CK and CK



Pinout

  Connection Diagram


Specifications

Operating temperature range ...........................0 to 70
Storage temperature range .........................-55 to 150
VDDSupply Voltage Relative to VSS................-1V to +3.6V
VDDQ Supply Voltage Relative to VSS.............-1V to +3.6V
VREF and Inputs Voltage Relative to VSS.......-1V to +3.6V
I/O Pins Voltage Relative to VSS........ -0.5V to VDDQ+0.5V
Power dissipation ................................................... 1.6 W
Data out current (short circuit) .............................. 50 mA

*Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage of the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.




Description

The ICSI IC43R16160 is a four bank DDR DRAM organized as 4 banks x 4Mbit x 16. The IC43R16160 achieves high speed data transfer rates by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock.

All of the control, address, circuits are synchronized with the positive edge of an externally supplied clock. I/O transactions of the IC43R16160 are ocurring on both edges of DQS. Operating the four memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device.




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