Features: · Low capacitance (C = 8.5pF max) and can protect ESD of signal line.· Ultra small Resin Package (URP) is suitable for surface mount design.Specifications Item Symbol Value Unit Reverse voltage Pd *1 200 V Junction temperature Tj 150 Storage ...
HZU6.2Z: Features: · Low capacitance (C = 8.5pF max) and can protect ESD of signal line.· Ultra small Resin Package (URP) is suitable for surface mount design.Specifications Item Symbol Value ...
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· Low capacitance (C = 8.5pF max) and can protect ESD of signal line.
· Ultra small Resin Package (URP) is suitable for surface mount design.
Item |
Symbol |
Value |
Unit |
Reverse voltage |
Pd *1 |
200 |
V |
Junction temperature |
Tj |
150 |
|
Storage temperature |
Tstg |
-55 to +150 |
Note: 1. Two device total, See Fig.2.