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HYM322160GS-60

PinoutSpecificationsOperation temperature range ................................................. 0 to + 70 °CStorage temperature range................................................. 55 to 125 °CSoldering temperature .................................................................... 260 °CSold...

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HYM322160GS-60: PinoutSpecificationsOperation temperature range ................................................. 0 to + 70 °CStorage temperature range................................................. 55 to 125 °CS...

HYM322160GS-60 Data Sheet

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Part Number:
HYM322160GS-60
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Pinout

Connection Diagram


Specifications

Operation temperature range ................................................. 0 to + 70 °C
Storage temperature range................................................. 55 to 125 °C
Soldering temperature .................................................................... 260 °C
Soldering time........................................................................................10 s
Input/output voltage ................................................................ 1 to + 7 V
Power supply voltage................................................................ 1 to + 7 V
Power dissipation.................................................................................6.2 W
Data out current (short circuit) ...........................................................50 mA
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage of the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.


Description

The HYM322160GS-60 is a 8 MByte DRAM module organized as 2 097 152 words by 32-Bit in a 72-pin single-in-line package comprising sixteen HYB514400BJ 1M x 4 DRAMs in 300 mil wide SOJ-packages mounted together with eight 0.2 F ceramic decoupling capacitors on a PC board.

The HYM322160GS-60 can also be used as a 4 194 304 words by 16-Bits dynamic RAM module by means of connecting DQ0 and DQ16, DQ1 and DQ17, DQ2 and DQ18, ., DQ15 and DQ31, respectively.

Each HYM322160GS-60 is described in the data sheet and is fully electrical tested and processed according to SIEMENS standard quality procedure prior to module assembly. After assembly onto the board, a further set of electrical tests is performed.

The speed of the module can be detected by the use of four presence detect pins.

The common I/O feature on the HYM HYM322160GS-60 dictates the use of early write cycles.




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