Features: • Fully Synchronous to Positive Clock Edge• 0to70 operating temperature• Four Banks controlled by BA0 & BA1• Programmable CAS Latency: 2 & 3• Programmable Wrap Sequence: Sequential or Interleave• Programmable Burst Length: 1, 2, 4, 8 and full p...
HYB39S256800: Features: • Fully Synchronous to Positive Clock Edge• 0to70 operating temperature• Four Banks controlled by BA0 & BA1• Programmable CAS Latency: 2 & 3• Programm...
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Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
Parameter |
Symbol |
Limit Values |
Unit | |
min. | max. | |||
Input / Output voltage relative to VSS | VIN, VOUT | 1.0 | 4.6 | V |
Power supply voltage | VDD, VDDQ | 1.0 | 4.6 | V |
Operating Temperature | TA | 0 | +70 | |
Storage temperature range | TSTG | -55 | +150 | |
Power dissipation per SDRAM component | PD | 1 | W | |
Data out current (short circuit) | IOS | 50 | mA | |
Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to recommended operation conditions. Exposure to higher than recommended voltage for extended periods of time affect device reliability |
The HYB39S256800 are four bank Synchronous DRAM's organized as 4 banks x 16MBit x4, 4 banks x 8MBit x8 and 4 banks x 4Mbit x16 respectively. These synchronous devices achieve high speed data transfer rates for CAS-latencies by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock. The chip is fabricated with INFINEON's advanced 0.14 µm 256MBit DRAM process technology.
The device HYB39S256800 is designed to comply with all industry standards set for synchronous DRAM products, both electrically and mechanically. All of the control, address, data input and output circuits are synchronized with the positive edge of an externally supplied clock.
Operating the four memory banks in an interleave fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device HYB39S256800.
Auto Refresh (CBR) and Self Refresh operation are supported. These devices HYB39S256800 operate with a single 3.3V +/- 0.3V power supply. All 256Mbit components are available in TSOPII-54 and TFBGA-54 packages.