HYB39S256400

Features: • Fully Synchronous to Positive Clock Edge• 0to70 operating temperature• Four Banks controlled by BA0 & BA1• Programmable CAS Latency: 2 & 3• Programmable Wrap Sequence: Sequential or Interleave• Programmable Burst Length: 1, 2, 4, 8 and full p...

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HYB39S256400 Picture
SeekIC No. : 004368997 Detail

HYB39S256400: Features: • Fully Synchronous to Positive Clock Edge• 0to70 operating temperature• Four Banks controlled by BA0 & BA1• Programmable CAS Latency: 2 & 3• Programm...

floor Price/Ceiling Price

Part Number:
HYB39S256400
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

• Fully Synchronous to Positive Clock Edge
• 0to70 operating temperature
• Four Banks controlled by BA0 & BA1
• Programmable CAS Latency: 2 & 3
• Programmable Wrap Sequence: Sequential
   or Interleave
• Programmable Burst Length:
   1, 2, 4, 8 and full page
• Multiple Burst Read with Single Write Operation
• Automatic and Controlled Precharge Command
• Data Mask for Read / Write control (x4, x8)
• Data Mask for byte control (x16)
• Auto Refresh (CBR) and Self Refresh
• Power Down and Clock Suspend Mode
• 8192 refresh cycles / 64 ms (7,8 µs)
• Random Column Address every CLK
   (1-NRule)
• Single 3.3V +/- 0.3V Power Supply
• LVTTL Interface versions
• Plastic Packages:
   P-TSOPII-54 400mil width (x4, x8, x16)
• Chipsize Packages:
   54 ball TFBGA (12 mm x 8 mm)
• -6 parts for PC166 3-3-3 operation
-7 parts for PC133 2-2-2 operation
-7.5 parts for PC133 3-3-3 operation
-8 parts for PC100 2-2-2 operation



Pinout

  Connection Diagram


Specifications

Parameter

Symbol

Limit Values

Unit

min. max.
Input / Output voltage relative to VSS VIN, VOUT 1.0 4.6 V
Power supply voltage VDD, VDDQ 1.0 4.6 V
Operating Temperature TA 0 +70  
Storage temperature range TSTG -55 +150  
Power dissipation per SDRAM component PD 1 W
Data out current (short circuit) IOS 50 mA
Permanent device damage may occur if "Absolute Maximum Ratings" are exceeded.
Functional operation should be restricted to recommended operation conditions.
Exposure to higher than recommended voltage for extended periods of time affect device reliability



Description

    The HYB39S256400/800/160DT(L) are four bank Synchronous DRAM's organized as 4 banks x 16MBit x4, 4 banks x 8MBit x8 and 4 banks x 4Mbit x16 respectively. These synchronous devices achieve high speed data transfer rates for CAS-latencies by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock. The chip is fabricated with INFINEON's advanced 0.14 µm 256MBit DRAM process technology.

    The device HYB39S256400 is designed to comply with all industry standards set for synchronous DRAM products, both electrically and mechanically. All of the control, address, data input and output circuits are synchronized with the positive edge of an externally supplied clock.

    Operating the four memory banks in an interleave fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device HYB39S256400.

    Auto Refresh (CBR) and Self Refresh operation are supported. These devices HYB39S256400 operate with a single 3.3V +/- 0.3V power supply. All 256Mbit components are available in TSOPII-54 and TFBGA-54 packages.




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