Features: • 4 194 304 words by 16-bit organization• 0 to 70 °C operating temperature• Fast access and cycle timeRAS access time: 50 ns (-50 version) 60 ns (-60 version) Cycle time: 90 ns (-50 version) 110 ns (-60 version)CAS access time: 13 ns ( -50 version)15 ns ( -60 version)...
HYB3165160T-50: Features: • 4 194 304 words by 16-bit organization• 0 to 70 °C operating temperature• Fast access and cycle timeRAS access time: 50 ns (-50 version) 60 ns (-60 version) Cycle time:...
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Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
Features: • 1 048 576 words by 16-bit organization• 0 to 70 °C operating temperature...
This device HYB3165160T-50 is a 64 MBit dynamic RAM organized 4 194 304 by 16 bits. The device is fabricated in SIEMENS/IBM most advanced first generation 64Mbit CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. This DRAM operates with a single 3.3 +/-0.3V power supply and interfaces with either LVTTL or LVCMOS levels. Multiplexed address inputs permit the HYB 3164(5)160T to be packaged in a 500 mil wide TSOP-54 plastic package. These HYB3165160T-50 packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment.