HYB3164800AJ50

Specifications

Operating temperature range.................................................................0 to 70 °C
Storage temperature range............................................................. 55 to 150 °C
Input/output voltage.......................................................-0.5 to min (Vcc+0.5,4.6) V
Power supply voltage..........................................................................-0.5V to 4.6 V
Power dissipation.............................................................................................1.0 W
Data out current (short circuit).........................................................................50 mA 


Description

This device HYB3164800AJ50 is a 64 MBit dynamic RAM organized 8 388 608 by 8 bits. The device is fabricated in an advanced second generation 64Mbit 0,35 µm CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. This DRAM operates with a single 3.3 +/-0.3V power supply   and  interfaces with either LVTTL or LVCMOS levels. Multiplexed address inputs permit the HYB 3164(5)800AJ/AT to be packaged in a 400mil wide SOJ-32 or TSOP-32 plastic package. These HYB3164800AJ50 packages provide high system bit densities and are compatible with commonly used automatic testing and insertion equipment. The HYB3164(5)800ATL parts (L-versions) have a very low power „sleep mode" supported by Self Refresh