HY5S6B6L

Features: Power Supply Voltage : VDD = 1.8V, VDDQ = 1.8V LVCMOS compatible I/O Interface Low Voltage interface to reduce I/O power Low Power Features- PASR(Partial Array Self Refresh)- AUTO TCSR (Temperature Compensated Self Refresh)- DS (Drive Strength)- Deep Power Down Mode Programmable CAS lat...

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SeekIC No. : 004368337 Detail

HY5S6B6L: Features: Power Supply Voltage : VDD = 1.8V, VDDQ = 1.8V LVCMOS compatible I/O Interface Low Voltage interface to reduce I/O power Low Power Features- PASR(Partial Array Self Refresh)- AUTO TCSR (T...

floor Price/Ceiling Price

Part Number:
HY5S6B6L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/10/31

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Product Details

Description



Features:

Power Supply Voltage : VDD = 1.8V, VDDQ = 1.8V
LVCMOS compatible I/O Interface
Low Voltage interface to reduce I/O power
Low Power Features
- PASR(Partial Array Self Refresh)
- AUTO TCSR (Temperature Compensated Self Refresh)
- DS (Drive Strength)
- Deep Power Down Mode
Programmable CAS latency of 1, 2 or 3
Package Type : 54ball, 0.8mm pitch FBGA (Lead Free, Lead)
HY5S6B6D(L/S)FP : Lead Free
HY5S6B6D(L/S)F : Lead



Description

The Hynix Low Power SDRAM HY5S6B6L is suited for non-PC application which use the batteries such as PDAs, 2.5G and 3G cellular phones with internet access and multimedia capabilities, mini-notebook, handheld PCs.

The Hynix HY5S6B6L is a 67,108,864bit CMOS Synchronous Dynamic Random Access Memory. It is organized as 4banks of 1,048,576x16.

The Low Power SDRAM HY5S6B6L provides for programmable options including CAS latency of 1, 2, or 3, READ or WRITE burst length of 1, 2, 4, 8, or full page, and the burst count sequence(sequential or interleave). And the Low Power SDRAM also provides for special programmable options including Partial Array Self Refresh of a quarter bank, a half bank, 1bank, 2banks, or all banks.

The Hynix HY5S6B6L has the special Low Power function of Auto TCSR(Temperature Compensated Self Refresh) to reduce self refresh current consumption. Since an internal temperature sensor is implanted, it enables to automatically adjust refresh rate according to temperature without external EMRS command. A burst of Read or Write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst Read or Write command on any cycle(This pipelined design is not restricted by a 2N rule).

Deep Power Down Mode is a additional operating mode for Low Power SDRAM HY5S6B6L. This mode can achieve  aximum power reduction by removing power to the memory array within each SDRAM. By using this  eature, the system can cut off alomost all DRAM power without adding the cost of a power switch and  iving up mother-board power-line layout flexibility.




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