HY27UF084G2M

Features: HIGH DENSITY NAND FLASH MEMORIES - Cost effective solutions for mass storage applicationsNAND INTERFACE - x8 width. - Multiplexed Address/ Data - Pinout compatibility for all densitiesSUPPLY VOLTAGE - 3.3V device: VCC = 2.7 to 3.6V : HY27UF084G2MMemory Cell Array = (2K+ 64) Bytes x 64 Pa...

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SeekIC No. : 004368163 Detail

HY27UF084G2M: Features: HIGH DENSITY NAND FLASH MEMORIES - Cost effective solutions for mass storage applicationsNAND INTERFACE - x8 width. - Multiplexed Address/ Data - Pinout compatibility for all densitiesSUPP...

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Part Number:
HY27UF084G2M
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/6

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Product Details

Description



Features:

HIGH DENSITY NAND FLASH MEMORIES
    - Cost effective solutions for mass storage applications
NAND INTERFACE
    - x8 width.
    - Multiplexed Address/ Data
    - Pinout compatibility for all densities
SUPPLY VOLTAGE
    - 3.3V device: VCC = 2.7 to 3.6V : HY27UF084G2M
Memory Cell Array
    = (2K+ 64) Bytes x 64 Pages x 4,096 Blocks
PAGE SIZE
    - x8 device : (2K + 64 spare) Bytes
                      : HY27UF084G2M
BLOCK SIZE
    - x8 device: (128K + 4K spare) Bytes
PAGE READ / PROGRAM
    - Random access: 25us (max.)
    - Sequential access: 30ns (min.)
    - Page program time: 200us (typ.) COPY BACK PROGRAM MODE
    - Fast page copy without external buffering
CACHE PROGRAM MODE
    - Internal Cache Register to improve the program throughput
FAST BLOCK ERASE
    - Block erase time: 2ms (Typ.)



Pinout

  Connection Diagram


Specifications

Symbol Parameter Value Unit
3.3V
TA Ambient Operating Temperature (Commercial Temperature Range) 0 to 70
Ambient Operating Temperature (Extended Temperature Range) -25 to 85
Ambient Operating Temperature (Industry Temperature Range) -40 to 85
TBIAS Temperature Under Bias -50 to 125
TSTG Storage Temperature -65 to 150
VIO(2) Input or Output Voltage -0.6 to 4.6 V
Vcc Supply Voltage -0.6 to 4.6 V



Description

The HYNIX HY27UF084G2M series is a 512Mx8bit with spare 16Mx8 bit capacity. The device is offered in 3.3V Vcc Power Supply.

HY27UF084G2M's NAND cell provides the most cost-effective solution for the solid state mass storage market.

The memory HY27UF084G2M is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased.

The device HY27UF084G2M contains 4096 blocks, composed by 64 pages consisting in two NAND structures of 32 series connected Flash cells. A program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) block.

Data in the page mode can be read out at 30ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. This HY27UF084G2M interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of footprint.

Commands, Data and Addresses are synchronously introduced using CE#, WE#, ALE and CLE input pin. The HY27UF084G2M on-chip Program/Erase Controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data.

The modifying can be locked using the WP# input pin or using the extended lock block feature described later. The output pin RB# (open drain buffer) signals the status of the device HY27UF084G2M during each operation. In a system with multiple memories the RB# pins can be connected all together to provide a global status signal.

Even the write-intensive systems can take advantage of the HY27UF084G2M extended reliability of 100K program/ erase cycles by providing ECC (Error Correcting Code) with real time mapping-out algorithm.

Optionally the chip HY27UF084G2M could be offered with the CE# don't care function. This option allows the direct download of the code from the NAND Flash memory device by a microcontroller, since the CE# transitions do not stop the read operation. The copy back function allows the optimization of defective blocks management: when a page program operation fails the data can be directly programmed in another page inside the same array section without the time consuming serial data insertion phase.

The cache program feature allows the data insertion in the cache register while the data register is copied into the flash array. This pipelined program operation improves the program throughput when long files are written inside the memory HY27UF084G2M.

A cache read feature is also implemented. This HY27UF084G2M feature allows to dramatically improve the read throughput when consecutive pages have to be streamed out.

This device HY27UF084G2M includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension.

The HYNIX HY27UF084G2M series is available in 48 - TSOP1 12 x 20 mm, 52-ULGA 12 x 17 mm.




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