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HWD2190

Features: Available in space-saving packages: micro SMD, MSOP, SOIC, and LLP Ultra low current shutdown mode BTL output can drive capacitive loads Improved pop & click circuitry eliminates noises during turn-on and turn-off transitions 2.2 - 5.5V operation No output coupling capacitors, snubbe...

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SeekIC No. : 004367974 Detail

HWD2190: Features: Available in space-saving packages: micro SMD, MSOP, SOIC, and LLP Ultra low current shutdown mode BTL output can drive capacitive loads Improved pop & click circuitry eliminates noise...

HWD2190 Data Sheet

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Part Number:
HWD2190
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

Available in space-saving packages: micro SMD, MSOP, SOIC, and LLP
Ultra low current shutdown mode
BTL output can drive capacitive loads
Improved pop & click circuitry eliminates noises during turn-on and turn-off transitions
2.2 - 5.5V operation
No output coupling capacitors, snubber networks or bootstrap capacitors required
Thermal shutdown protection
Unity-gain stable
External gain configuration capability


Application

Mobile Phones
PDAs
Portable electronic devices


Pinout

Connection Diagram


Specifications

If Military/Aerospace specified devices are required,
please contact the CSMSC Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (Note 11)              6.0V
Storage Temperature                    −65°C to +150°C
Input Voltage                                −0.3V to VDD +0.3V
Power Dissipation (Note 3)            Internally Limited
ESD Susceptibility (Note 4)             2000V
Junction Temperature                     150°C
Thermal Resistance
JC (SOP)                                         35°C/W
JA (SOP)                                        150°C/W
JA (8 Bump micro SMD, Note 12)    220°C/W
JA (9 Bump micro SMD, Note 12)    180°C/W
JC (MSOP)                                      56°C/W
JA (MSOP)                                      190°C/W
JA (LLP)                                          220°C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package."
See AN-1187 "Leadless Leadframe Package (LLP)."


Description

The HWD2190 is an audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1 watt of continuous average power to an 8
BTL load with less than 1% distortion (THD+N) from a 5VDC power supply.

HWD2190 audio power amplifiers were designed specifically to provide high quality output power with a minimal amount of  external components. The HWD2190 does not require output coupling capacitors or bootstrap capacitors, and therefore is ideally suited for mobile phone and other low voltage applications where minimal power consumption is a primary requirement.

The HWD2190 features a low-power consumption shutdown mode, which is achieved by driving the shutdown pin with logic low. Additionally, the HWD2190 features an internal thermal shutdown protection mechanism.
The HWD2190 contains advanced pop & click circuitry which eliminates noises which would otherwise occur during turn-on and turn-off transitions.

The HWD2190 is unity-gain stable and can be configured by external gain-setting resistors.




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