Features: • Low forward resistance. (rf = 5.5 Ω max)• MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 60 V Forward current IF 50 mA Power dissipation Pd *1 1...
HVM189S: Features: • Low forward resistance. (rf = 5.5 Ω max)• MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Val...
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Item | Symbol | Value | Unit |
Reverse voltage | VR | 60 | V |
Forward current | IF | 50 | mA |
Power dissipation | Pd *1 | 100 | mW |
Junction temperature | Tj | 125 | |
Storage temperature | Tstg | −55 to +125 |