HVM189S

Features: • Low forward resistance. (rf = 5.5 Ω max)• MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 60 V Forward current IF 50 mA Power dissipation Pd *1 1...

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HVM189S Picture
SeekIC No. : 004367853 Detail

HVM189S: Features: • Low forward resistance. (rf = 5.5 Ω max)• MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Val...

floor Price/Ceiling Price

Part Number:
HVM189S
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

• Low forward resistance. (rf = 5.5 Ω max)
• MPAK package is suitable for high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item Symbol Value Unit
Reverse voltage VR 60 V
Forward current IF 50 mA
Power dissipation Pd *1 100 mW
Junction temperature Tj 125
Storage temperature Tstg −55 to +125



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