Features: · Low forward resistance. (rf = 5.5 max)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 60 V Forward current IF 50 mA Power dissipation ...
HVM187WK: Features: · Low forward resistance. (rf = 5.5 max)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit ...
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Item |
Symbol |
Value |
Unit |
Reverse voltage | VR |
60 |
V |
Forward current |
IF |
50 |
mA |
Power dissipation |
Pd*1 |
100 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
-55 to +125 |