Features: • Low capacitance.(C=0.5pF max)• Low forward resistance. (rf=2.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly.Specifications Item Symbol Value Unit Peak reverse voltage VRM 65 V Reverse v...
HVM132: Features: • Low capacitance.(C=0.5pF max)• Low forward resistance. (rf=2.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly.Specific...
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• Low capacitance.(C=0.5pF max)
• Low forward resistance. (rf=2.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
Item |
Symbol |
Value |
Unit |
Peak reverse voltage |
VRM |
65 |
V |
Reverse voltage |
VR |
60 |
V |
Forward current |
I F |
100 |
mA |
Power dissipation |
Pd * |
150 |
A |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
-55 to +125 |