Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly. Specifications Item Symbol Value Unit Peak reverse voltage VRM 65 V Revers...
HVM131SR: Features: • Low capacitance.(C=0.8pF max)• Low forward resistance. (rf=1.0½ max)• MPAK package is suitable for high density surface mounting and high speed assembly. Specifi...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
• Low capacitance.(C=0.8pF max)
• Low forward resistance. (rf=1.0½ max)
• MPAK package is suitable for high density surface mounting and high speed assembly.
Item |
Symbol |
Value |
Unit |
Peak reverse voltage |
VRM |
65 |
V |
Reverse voltage |
VR |
60 |
V |
Forward current |
I F * |
100 |
mA |
Power dissipation |
Pd * |
150 |
A |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
-55 to +125 |
* Two device total