Features: • Adopting the trench structure improves low capacitance.(C = 0.31 pF max)• Low forward resistance. (rf = 1.5 max)• Low operation current.• Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design.SpecificationsReverse voltage VR...........
HVL147M: Features: • Adopting the trench structure improves low capacitance.(C = 0.31 pF max)• Low forward resistance. (rf = 1.5 max)• Low operation current.• Thin Extremely small Fl...
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