HVL147

Features: • Adopting the trench structure improves low capacitance. (C = 0.31 pF max)• Low forward resistance. (rf = 1.5 Ω max)• Low operation current.• Extremely small Flat Lead Package (EFP) is suitable for surface mount design.Specifications Item Symbol ...

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HVL147 Picture
SeekIC No. : 004367814 Detail

HVL147: Features: • Adopting the trench structure improves low capacitance. (C = 0.31 pF max)• Low forward resistance. (rf = 1.5 Ω max)• Low operation current.• Extremely small...

floor Price/Ceiling Price

Part Number:
HVL147
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/9/16

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Product Details

Description



Features:

• Adopting the trench structure improves low capacitance. (C = 0.31 pF max)
• Low forward resistance. (rf = 1.5 Ω max)
• Low operation current.
• Extremely small Flat Lead Package (EFP) is suitable for surface mount design.



Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
30
V
Forward current
IF
100
mA
Power dissipation
Pd
100
mW
Junction temperature
Tj
125
Storage temperature
Tstg
−55 to +125



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