Features: • Adopting the trench structure improves low capacitance.(C = 0.43 pF max)• Low forward resistance. (rf = 1.8 max)• Low operation current.• Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design.Specifications Item Symbol Value ...
HVL144AM: Features: • Adopting the trench structure improves low capacitance.(C = 0.43 pF max)• Low forward resistance. (rf = 1.8 max)• Low operation current.• Thin Extremely small Fl...
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Item | Symbol | Value | Unit |
Reverse voltage | VR | 30 | V |
Forward current | IF | 100 | mA |
Power dissipation | Pd | 100 | mW |
Junction temperature | Tj | 125 | °C |
Storage temperature | Tstg | −55 to +125 | °C |