Features: • Adopting the trench structure improves low capacitance.(C = 0.31 pF max)• Low forward resistance. (rf = 1.5 max)• Low operation current.• Super small Flat Package (SFP) is suitable for surface mount design.PinoutSpecifications Item Symbol Value Un...
HVD147: Features: • Adopting the trench structure improves low capacitance.(C = 0.31 pF max)• Low forward resistance. (rf = 1.5 max)• Low operation current.• Super small Flat Packag...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
30 |
V |
Forward current |
IF |
100 |
mA |
Power dissipation |
Pd |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
−55 to +125 |