Features: • Adopting the trench structure improves low capacitance. (C = 0.9 pF max)• Low forward resistance. (rf = 1.1 max)• Low operation current.• Super small Flat Package (SFP) is suitable for surface mount design.SpecificationsReverse voltage VR .........................
HVD138: Features: • Adopting the trench structure improves low capacitance. (C = 0.9 pF max)• Low forward resistance. (rf = 1.1 max)• Low operation current.• Super small Flat Packag...
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