Features: · Low matching error. (ÆC/C =2.0%max)· High capacitance ratio. (n =6.22min)· Low series resistance. (rs=0.65½max)· Ultra small Flat Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value Unit Peak reverse voltage VRM*1 ...
HVC322B: Features: · Low matching error. (ÆC/C =2.0%max)· High capacitance ratio. (n =6.22min)· Low series resistance. (rs=0.65½max)· Ultra small Flat Package (UFP) is suitable for surface mount...
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· Low matching error. (ÆC/C =2.0%max)
· High capacitance ratio. (n =6.22min)
· Low series resistance. (rs=0.65½max)
· Ultra small Flat Package (UFP) is suitable for surface mount design.
Item |
Symbol |
Value |
Unit |
Peak reverse voltage |
VRM*1 |
35 |
V |
Forward current |
VR |
34 |
V |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
-55 to +125 |
Note 1. RL=4.7K½