Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 typ)• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.Specifications Item Symbol Value Unit Reverse voltage VR 50 V Forward current IF ...
HVC190: Features: • Low capacitance. (C = 0.35 pF max)• Low forward resistance. (rf = 3.0 typ)• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.Specifications ...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
50 |
V |
Forward current |
IF |
50 |
mA |
Power dissipation |
Pd*1 |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
−55 to +125 |