Features: ` Adopting the trench structure improves low capacitance.(C = 0.45 pF max)` Low forward resistance. (rf = 2.5 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.Specifications Item Sy...
HVC136: Features: ` Adopting the trench structure improves low capacitance.(C = 0.45 pF max)` Low forward resistance. (rf = 2.5 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for s...
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` Adopting the trench structure improves low capacitance.(C = 0.45 pF max)
` Low forward resistance. (rf = 2.5 max)
` Low operation current.
` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.
Item |
Symbol |
Value |
Unit |
Peak reverse voltage |
VRM |
65 |
V |
Reverse voltage |
VR |
60 |
V |
Forward current |
IF |
100 |
mA |
Power dissipation |
Pd |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
−55 to +125 |