Features: ` Adopting the trench structure improves low capacitance.(C=0.6pF max)` Low forward resistance. (rf=2.0 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.Specifications Item Symbol ...
HVC135: Features: ` Adopting the trench structure improves low capacitance.(C=0.6pF max)` Low forward resistance. (rf=2.0 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for surface...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VRM |
65 |
V |
Reverse voltage |
VR |
60 |
V |
Forward current |
IF |
100 |
mA |
Power dissipation |
Pd |
150 |
mW |
Junction temperature |
Tj |
125 |
|
Storage temperature |
Tstg |
−55 to +125 |