HVC135

Features: ` Adopting the trench structure improves low capacitance.(C=0.6pF max)` Low forward resistance. (rf=2.0 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.Specifications Item Symbol ...

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HVC135 Picture
SeekIC No. : 004367697 Detail

HVC135: Features: ` Adopting the trench structure improves low capacitance.(C=0.6pF max)` Low forward resistance. (rf=2.0 max)` Low operation current.` Ultra small Flat Package (UFP) is suitable for surface...

floor Price/Ceiling Price

Part Number:
HVC135
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

` Adopting the trench structure improves low capacitance.(C=0.6pF max)
` Low forward resistance. (rf=2.0 max)
` Low operation current.
` Ultra small Flat Package (UFP) is suitable for surface mount design and stable rf characteristics in high frequency.





Specifications

Item
Symbol
Value
Unit
Reverse voltage
VRM
65
V
Reverse voltage
VR
60
V
Forward current
IF
100
mA
Power dissipation
Pd
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
−55 to +125





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