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HUFA76504DK8

Features: • Ultra Low On-Resistance - r DS(ON) = 0.200W, VGS = 10V - r DS(ON) = 0.222W, VGS = 5V• Simulation Models - Temperature Compensated PSPICE™ and SABER Electrical Models - Spice and SABER Thermal Impedance Models- www.Fairchildsemi.com• Internal RG = 50• Peak ...

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SeekIC No. : 004367368 Detail

HUFA76504DK8: Features: • Ultra Low On-Resistance - r DS(ON) = 0.200W, VGS = 10V - r DS(ON) = 0.222W, VGS = 5V• Simulation Models - Temperature Compensated PSPICE™ and SABER Electrical Models - ...

HUFA76504DK8 Data Sheet

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Part Number:
HUFA76504DK8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Ultra Low On-Resistance
  - r DS(ON) = 0.200W, VGS = 10V
  - r DS(ON) = 0.222W, VGS = 5V
• Simulation Models
  - Temperature Compensated PSPICE™ and SABER Electrical Models
  - Spice and SABER Thermal Impedance Models
- www.Fairchildsemi.com
• Internal RG = 50
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Transient Thermal Impedance Curve vs Board Mounting Area


Specifications

Drain to Source Voltage (Note 1)............................ VDSS 80 V
Drain to Gate Voltage (RGS = 20k) (Note 1)  ..................... VDGR 80 V
Gate to Source Voltage  ................................ VGS ±16 V
Drain Current
Continuous (TC = 25, VGS = 5V) ............................. ID2.3A
Continuous (TC = 25, VGS = 10V) (Figure 2)(Note 2) ...................ID2.5A
Continuous (TC = 100, VGS = 5V) .............................ID1.1A
Continuous (TC = 100, VGS = 4.5V) (Figure 2)(Note 3)  ..................ID1.1A
Pulsed Drain Current  .................................IDM Figure 4
Pulsed Avalanche Rating ...........................UIS Figures 6, 17, 18
Power Dissipation  ....................................V PD2.5W
Derate Above 25 .....................................20W/
Operating and Storage Temperature  ....................TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s ........................TL300
Package Body for 10s, See Techbrief TB334  .......................Tpkg260
NOTES:
1. TJ = 25 to 150.
2. 50/W measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 1 second.
3. 228/W measured using FR-4 board with 0.006 in2 (3.87 mm2) copper pad at 1000 seconds.
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.





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