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HUFA75831SK8

Features: • Ultra Low On-Resistance - rDS(ON) = 0.095, VGS = 10V• Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - Spice and SABER Thermal Impedance Models -www.fairchildsemi.com• Peak Current vs Pulse Width Curve• UIS Rating Curv...

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SeekIC No. : 004367366 Detail

HUFA75831SK8: Features: • Ultra Low On-Resistance - rDS(ON) = 0.095, VGS = 10V• Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - Spice and SABER Thermal Imp...

HUFA75831SK8 Data Sheet

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Part Number:
HUFA75831SK8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

• Ultra Low On-Resistance
   - rDS(ON) = 0.095, VGS = 10V
• Simulation Models
   - Temperature Compensated PSPICE® and SABER™ Electrical Models
   - Spice and SABER Thermal Impedance Models
   - www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve


Specifications

                                                                                         HUFA75831SK8  UNITS
Drain to Source Voltage (Note 1) . . . . . .  . . . . . . . . VDSS           150           V
Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . VDGR           150            V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . VGS           ±20           V
Drain Current
Continuous (TA = 25, VGS = 10V) (Figure 2) . . . . . . .ID             3               A
Continuous (TA = 100, VGS = 10V) (Figure 2) . . . . .  ID             2               A
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . ... IDM        Figure 4
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . .. . . . UIS      Figures 6, 14, 15
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate Above 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .     2.5           W
                                                                                                      20         mW/
Operating and Storage Temperature . . . . . . .  . . . TJ, TSTG    -55 to 150     
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . .... . TL          300         
Package Body for 10s, See Tech Brief TB370 . . . . . .. . Tpkg          260         

NOTES:
1. TJ = 25 to 125.
2. 50/W measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 10 second.
3. 152/W measured using FR-4 board with 0.054 in2 (34.8 mm2) copper pad at 1000 seconds
4. 189/W measured using FR-4 board with 0.0115 in2 (7.42 mm2) copper pad at 1000 seconds
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.



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