HUFA75333G3

MOSFET 66a 55V 0.016Ohm NCh UltraFET

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SeekIC No. : 00151998 Detail

HUFA75333G3: MOSFET 66a 55V 0.016Ohm NCh UltraFET

floor Price/Ceiling Price

US $ 1~1.62 / Piece | Get Latest Price
Part Number:
HUFA75333G3
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
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  • 1~25
  • 25~100
  • 100~250
  • Unit Price
  • $1.62
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  • Processing time
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Upload time: 2024/12/21

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 55 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 66 A
Resistance Drain-Source RDS (on) : 0.016 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : Through Hole
Package / Case : TO-247 Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : Through Hole
Packaging : Tube
Drain-Source Breakdown Voltage : 55 V
Package / Case : TO-247
Continuous Drain Current : 66 A
Resistance Drain-Source RDS (on) : 0.016 Ohms


Features:

• 66A, 55V
• Simulation Models
  - Temperature Compensated PSPICE® and SABER™ Models
  - SPICE and SABER Thermal Impedance ModelsAvailable on the WEB at: www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
  - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

Drain to Source Voltage (Note 1)   .......................... VDSS 55 V
Drain to Gate Voltage (RGS = 20k) (Note 1) .................... VDGR 55 V
Gate to Source Voltage ............................... VGS ±20 V
Drain Current
Continuous (Figure 2)  ..................................ID35 A
Pulsed Drain Current ................................IDM Figure 4
Pulsed Avalanche Rating  .........................EAS Figures 6, 14, 15
Power Dissipation ....................................PD 93W
Derate Above 25 ..................................0.625W/
Operating and Storage Temperature ...................TJ, TSTG -55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s ......................TL 300
Package Body for 10s, See Techbrief 334.......................Tpkg 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25 to 150.




Description

These N-Channel power MOSFETs HUFA75333G3 are manufactured using the innovative UltraFET® process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. HUFA75333G3 was designed for use in applications where power efficiency is important, such as switching regulators, switching convertors, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.

Formerly developmental type TA75333




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