HUF76419D3S

MOSFET

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HUF76419D3S Picture
SeekIC No. : 00166781 Detail

HUF76419D3S: MOSFET

floor Price/Ceiling Price

Part Number:
HUF76419D3S
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/5/31

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 16 V Continuous Drain Current : 20 A
Resistance Drain-Source RDS (on) : 0.037 Ohms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : TO-252AA Packaging : Rail    

Description

Transistor Polarity : N-Channel
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Continuous Drain Current : 20 A
Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 16 V
Resistance Drain-Source RDS (on) : 0.037 Ohms
Package / Case : TO-252AA
Packaging : Rail


Features:

• Ultra Low On-Resistance
         - rDS(ON) = 0.037Ω, VGS = 10V
         - rDS(ON) = 0.043Ω, VGS = 5V
• Simulation Models
         - Temperature Compensated PSPICE® and SABER© Electrical Models
         - Spice and SABER© Thermal Impedance Models
         - www.semi.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs RGS Curves



Specifications

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID 20 A
Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID 20 A
Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID 20 A
Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID 19 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM Figure 4  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS Figures 6, 17, 18  
Power Dissipation . . . . . . .. . . . . . PD
75 W
Derate Above . . . . . . . . . . . . .25 0.5 W/
Operating and Storage Temperature . . . . . TJ, TSTG -55 to 175
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL 300
Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg 260



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